XC4VLX200-10FFG1513C

Product Summary

The XC4VLX200-10FFG1513C is the newest generation FPGA from Xilinx. The innovative Advanced Silicon Modular Block or ASMBL column-based architecture is unique in the programmable logic industry. A wide array of hard-IP core blocks complete the system solution. These cores include the PowerPC processors (with a new APU interface), Tri-Mode Ethernet MACs, 622 Mb/s to 11.1 Gb/s serial transceivers, voltage/temperature system monitor blocks, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The XC4VLX200-10FFG1513C is produced on a state-of-the-art 90-nm copper process, using 300 mm (12 inch) wafer technology. Combining a wide variety of flexible features, the XC4VLX200-10FFG1513C enhances programmable logic design capabilities and is a powerful alternative to ASIC technology.

Parametrics

XC4VLX200-10FFG1513C absolute maximum ratings: (1)VCCINT, Internal supply voltage relative to GND: –0.5 to 1.32 V; (2)VCCAUX, Auxiliary supply voltage relative to GND: –0.5 to 3.0 V; (3)VCCO, Output drivers supply voltage relative to GND: –0.5 to 3.75 V; (4)VBATT, Key memory battery backup supply: –0.5 to 4.05 V; (5)VREF, Input reference voltage: –0.3 to 3.75 V; (6)VIN: I/O input voltage relative to GND(all user and dedicated I/Os): –0.75 to 4.05 V; I/O input voltage relative to GND(restricted to maximum of 100 user I/Os): –0.95 to 4.4v (Commercial Temperature); –0.85 to 4.3v (Industrial Temperature); 2.5V or below I/O input voltage relative to GND (user and dedicated I/Os): –0.75 to VCCO +0.5 V; (7)IIN: Current applied to an I/O pin, powered or unpowered: ±100 mA; Total current applied to all I/O pins, powered or unpowered: ±200 mA; (8) Voltage applied to 3-state 3.3V output(all user and dedicated I/Os): –0.75 to 4.05 V; (9)Voltage applied to 3-state 3.3V output(restricted to maximum of 100 user I/Os): –0.95 to 4.4 v (Commercial Temperature); –0.85 to 4.3(Industrial Temperature)V; (10)2.5V or below I/O input voltage relative to GND(user and dedicated I/Os): –0.75 to VCCO +0.5 V; (11)AVCCAUXRX, Receive auxiliary supply voltage relative to analog ground, GNDA(RocketIO pins): –0.5 to 1.32 V; (12)AVCCAUXTX, Transmit auxiliary supply voltage relative to analog ground, GNDA(RocketIO pins): –0.5 to 1.32 V.

Features

XC4VLX200-10FFG1513C features: (1)Three families LX/SX/FX: Virtex-4 LX: High-performance logic applications solution; Virtex-4 FX: High-performance, full-featured solution for embedded platform applications; Virtex-4 SX: High-performance solution for Digital Signal Processing (DSP) applications; (2)Xesium Clock Technology: Digital Clock Manager (DCM) blocks; Additional Phase-Matched Clock Dividers (PMCD); Differential Global Clocks; (3)XtremeDSP Slice: 18x18, twos complement, signed Multiplier; Optional pipeline stages; built-In Accumulator (48-bits) & Adder/Subtracter; (4)Smart RAM Memory Hierarchy: Distributed RAM; Dual-Port 18-Kbit RAM blocks: Optional pipeline stages; Optional programmable FIFO logic-Automatically remaps RAM signals as FIFO signals; High-speed memory interface support: DDR and DDR-2 SDRAM, QDR-II, RLDRAM-II, and FCRAM-I; (5)SelectIO Technology: 1.5 to 3.3 V I/O Operation; Built-In ChipSync Source-Synchronous Technology; Digitally-controlled impedance (DCI) active termination; Fine grained I/O banking (Configuration in one bank); (6)Flexible Logic Resources; (7)Built-in System Monitor (voltage/temp. measurement); (8)10-bit, 200kSPS A/D Converter (ADC); (9)Secure Chip AES Bitstream Encryption; (10)90-nm copper CMOS process; (11)1.2V core voltage.

Diagrams